Rogers RO4730G3 High Frequency PCB 2-Layer Rogers 4730 20mil (0.508mm) Printed Circuit Board DK3.0 DF 0.0028 Microwave PCB
(Printed Circuit Boards are custom-made products; the pictures and parameters shown are for reference only)
Rogers RO4730G3 antenna-grade laminates offer a reliable and cost-effective alternative to traditional PTFE-based laminates. This material provides the essential mechanical and electrical properties required by antenna designers. With a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz using LoPro Reverse Treated EDC foil, these values enable antenna designers to achieve significant gain while minimizing signal loss. The materials demonstrate low Passive Intermodulation (PIM) performance, with values exceeding -160dBc.
RO4730G3 is compatible with standard epoxy and high-temperature lead-free solder processing. Unlike conventional PTFE-based laminates, it does not require special treatments for plated through holes preparation. Multi-layer configurations can be achieved using RO4450F bondply at 175°C. The resin systems in RO4730G3 are engineered to deliver the desired properties for antenna design, featuring a glass transition temperature exceeding 280°C. This results in a low Z-axis coefficient of thermal expansion (CTE), excellent reliability for plated through holes, and compatibility with lead-free solder processes.
Typical application is cellular base station antennas.
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General Description
This is a double-sided RF PCB built on 0.508mm (20mil) RO4730G3, specifically designed for Cellular Base Station Antenna applications.
Basic Specifications
PCB Capability (RO4730G3) |
|
PCB Material: |
Hydrocarbon ceramic woven glass |
Designator: |
RO4730G3 |
Dielectric constant: |
3.0 ±0.05 (process) |
2.98 (design) |
|
Layer count: |
1-layer, 2-layer, Multi-layer, Hybrid configuration |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness (low profile copper): |
5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
Laminate thickness (ED Copper) |
20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc. |
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(Data Sheet of Rogers 4730 (RO4730G3))
RO4730G3 Typical Value |
|||||
Property |
RO4730G3 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.0±0.5 |
Z |
|
10 GHz 23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.98 |
Z |
|
1.7 GHz to 5 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0028 |
Z |
|
10 GHz 23℃ |
IPC-TM-650 2.5.5.5 |
|
2.5 GHz |
||||
Thermal Coefficient of ε |
+34 |
Z |
ppm/℃ |
-50 ℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
<0.4 |
X, Y |
mm/m |
after etech +E2/150 ℃ |
IPC-TM-650 2.4.39A |
Volume Resistivity (0.030") |
9 X 107 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity (0.030") |
7.2 X 107 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
PIM |
-165 |
|
dBc |
50 ohm 0.060" |
43 dBm 1900 MHz |
Electrical Strength (0.030") |
730 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
Flexural Strength MD |
181 (26.3) |
|
Mpa (kpsi) |
RT |
ASTM D790 |
CMD |
139 (20.2) |
|
|||
Moisure Absorption |
0.093 |
- |
% |
48/50 |
IPC-TM-650 2.6.2.1 ASTM D570 |
Thermal Conductivity |
0.45 |
Z |
W/mK |
50℃ |
ASTM D5470 |
Coefficient of Thermal Expansion |
15.9 |
X |
ppm/℃ |
-50 ℃to 288℃ |
IPC-TM-650 2.4.4.1 |
Tg |
>280 |
|
℃ |
|
IPC-TM-650 2.4.24 |
Td |
411 |
|
℃ |
|
ASTM D3850 |
Density |
1.58 |
|
gm/cm3 |
|
ASTM D792 |
Copper Peel Stength |
4.1 |
|
pli |
1oz,LoPro EDC |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|